Semiconductor yield improvement: results and best practices

Abstract

The results of a world-wide study on yield improvement are presented. Die yields collected from 21 fabs are transformed via a logit formula and compared. The die yields and die yield improvement rates of the fabs are compared, and manufacturing yield improvement practices are evaluated. Preliminary results of this continuing study indicate that die yield improvement is a function of computer-aided manufacturing practices and statistical process control practices in addition to commonly cited practices such as particle control and advanced manufacturing technology.>

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