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Purpose The purpose of this paper is twofold: first, a case study on applying lean principles in manufacturing operations to redesign and optimize an electronic device assembly process and its impact on performance and second, introducing cardboard prototyping as a Kaizen tool offering a novel approach to testing and simulating improvement scenarios. Design/methodology/approach The study employs value stream mapping, root cause analysis, and brainstorming tools to identify root causes of poor performance, followed by deploying a Kaizen event to redesign and optimize an electronic device assembly process. Using physical models, bottlenecks and opportunities for improvement were identified by the Kaizen approach at the workstations and assembly lines, enabling the testing of various scenarios and ideas. Changes in lead times, throughput, work in process inventory and assembly performance were analyzed and documented. Findings Pre- and post-improvement measures are provided to demonstrate the impact of the Kaizen event on the performance of the assembly cell. The study reveals that implementing lean tools and techniques reduced costs and increased throughput by reducing assembly cycle times, manufacturing lead time, space utilization, labor overtime and work-in-process inventory requirements. Originality/value This paper adds a new dimension to applying the Kaizen methodology in manufacturing processes by introducing cardboard prototyping, which offers a novel way of testing and simulating different scenarios for improvement. The paper describes the process implementation in detail, including the techniques and data utilized to improve the process.
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Stored only when both papers are in the corpus — 13 citations exist upstream.
Papers that cite the same references — the relational fallback while embeddings are still backfilling.
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