Co-creation as a risk-sharing strategy for the development of innovative EUV lithography technology in the semiconductor industry

Abstract

Co-creation is becoming an innovative way for new technology development (NTD). We propose a four-staged co-creation model drawn upon a backdrop of ‘knowledge cloud’ for value creation and long-term customer commitment resulting in risk-sharing associated with NTD. The model is elaborated through the case of a leading semiconductor lithography equipment manufacturer (ASML) developing a new extreme ultraviolet lithography technology by engaging the major stakeholders in customer co-investment programme. The model is generic and applicable to any technology-driven industry and may include more stakeholders of same or allied technology.

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